UF6008 Chip Underfill Adhesive for Nand CPU Packaging BGA CPS Circuit Board Protection

Market Price: US $  /PC

• The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes

• Cure within 1 min/under 150°C or within 5 min/under 100°C automatically

• Being softened under high temperature, simplify the process of rework

• Superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device

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Description

Specifications:  

Product Name

Chip Underfill 

Model

UF6008

Brand

JCID

Storage conditions

keep stored in cool places at room temperature

Made for

Nand CPU packaging

 

Features:

JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging.  With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.

 

List of Packing:

 

Package Details:

 

Box Dimension:

Carton Dimension: 

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