Specifications:

Features:
Nano cleaning sponge
Designed for Precision Components
High Density High Adsorption Reusable Lint-Free
High-Density structure for superior dirt removal

Fine pores effectively trap even the smallest dust particles
Made with a high-density micro-cell structure,the sponge features uniform,ultra-fine pores that reacg into solder joints,narrow gaps, and hard-to-clean  areas for thorough cleaning

effectively traps dirt,flux residue,and fingerprint olis for fast and thorough cleaning with every wipe
Highly  Absorbent for efficient cleaning
Quickly removes grease,dust, and debris
Its nano-cell  micro-porous  structure delivers exceptional dirt-trap-ping performance
Its nano-cell  micro-porous  structure delivers exceptional dirt-trap -ping performance

Residue-Free & Lint-Free
Leaves no residue, helping protect delicate components
Made from carefully selected materials that won’t shed particles easily
Leaves no fibers or debris behind after cleaning
Helps keep critical components such as smartphone chips and camera modules free form lint and particle contamination

Compact size for precision cleaning
Eech sponge measures just 10X10mm, making it compact and easy to handle
Easily reaches motherboard gaps,chip edges,and around camera modules,minimizing unnecessary contact with surrounding areas for more precise and efficient cleaning while helping protect nearby components
Wide range of applications
Suitable for chips,Motherboards,Frames&Camera Modules
Chip Cleaning
Removes oxidation and flux residue,restoring a clean,residue-free chip surface

List of Packing:

HM-5 Nano Cleaning Sponge*1
Size:10*50*50mm